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5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

    Buy cheap 5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity from wholesalers
     
    Buy cheap 5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity from wholesalers
    • Buy cheap 5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity from wholesalers
    • Buy cheap 5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity from wholesalers
    • Buy cheap 5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity from wholesalers

    5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

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    Brand Name : HUITIAN
    Model Number : 5280
    Certification : RoHS REACH
    Price : Negotiation
    Payment Terms : L/C,T/T
    Supply Ability : 2000T/Month
    Delivery Time : 5-8 days
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    5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity


    Product Description

    5280 Potting Compound is a high-performance, two-part addition-type silicone rubber designed specifically for the electronics industry. This gray, high thermal conductive compound offers exceptional insulation properties, flame retardancy, and mechanical stability over a wide temperature range. It is ideal for protecting sensitive electronic components from environmental hazards while ensuring long-term reliability and performance.


    Product Applications

    The 5280CA9/5280CB9 Potting Compound is widely used in various electronic applications, including:
    • Module Power Supplies: Provides moistureproofing and insulation to protect against short circuits and corrosion.
    • LED Drive Power Supplies: Ensures thermal management and mechanical stability, prolonging the lifespan of LED components.
    • Network Transformers: Offers excellent insulation and anti-fouling properties to maintain signal integrity.
    • Reversing Radars: Protects sensitive radar components from moisture and physical shock, ensuring reliable operation.
    • General Electronics: Suitable for a wide range of electronic components, providing comprehensive protection against moisture, dust, corrosion, and mechanical shock.


    Key Product Features

    • High Thermal Conductivity: With a thermal conductivity of ≥0.6 W/m·K, the compound efficiently dissipates heat, ensuring optimal performance of electronic components.
    • UL94V-0 Flame Retardant: Meets stringent safety standards, providing excellent fire resistance and reducing the risk of electrical fires.
    • Excellent Insulation: Features a dielectric strength of ≥14 KV/mm, ensuring reliable electrical insulation and preventing short circuits.
    • Wide Temperature Range: Maintains rubber elasticity from -50°C to 200°C, ensuring consistent performance in extreme conditions.
    • RoHS Compliant: Environmentally friendly and compliant with the Restriction of Hazardous Substances Directive, making it suitable for use in a wide range of applications.
    • Ease of Use: 1:1 mix ratio simplifies the application process, ensuring consistent performance and reducing the risk of errors.


    Technical Parameters

    ParameterValue
    Physical Properties Before Curing (25±2℃, 60%±5%RH)
    Appearance (A)Gray flow
    Appearance (B)White flow
    Viscosity (A)2,000~3,500 mPa·s
    Viscosity (B)2,000~3,500 mPa·s
    Curing Properties (A:B=1:1)
    Operating Time (25℃)60~240 min
    Curing Time (85℃)≤30 min
    Physical Properties After Curing (25±2℃, 60±5%RH, A:B=1:1)
    Density1.70~1.9 g/cm³
    Hardness10~30 Shore A
    Shear Strength (PCB)0.3-0.8 MPa
    Thermal Conductivity≥0.6 W/m·K
    Dielectric Strength≥14 KV/mm
    Volume Resistivity≥1.0×10¹² Ω·cm


    Directions for Use

    Preparation

    • Stirring: Fully stir part A and part B separately, either manually or mechanically, to ensure homogeneity and avoid performance changes due to filler settlement.

    Mixing

    • Weighing: Accurately weigh the two parts into a clean container by weight ratio (1:1) and stir well to ensure thorough mixing.

    Defoaming

    • Natural Defoaming: Allow 20-30 minutes for natural defoaming after filling the mixed glue into the components.
    • Vacuum Defoaming: For faster defoaming, pot the components after pumping for 5-10 minutes at a vacuum degree of 0.08-0.1 MPa.

    Potting

    • Surface Preparation: Ensure the surfaces to be potted are clean and dry. Apply the glue while it still has good flowability to achieve optimal leveling.

    Curing

    • Curing Conditions: The glue can cure at room temperature or by heating. Higher temperatures accelerate curing, and heat curing is recommended in colder conditions (e.g., winter).


    Packaging & Storage Conditions
    Packaging:

    • 5280CA9 (20 kg/barrel), 5280CB9 (20 kg/barrel)
    • Storage: Store at room temperature in a cool and dry place. The shelf life is 6 months.


    Quality 5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity for sale
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